applications ? multi-phase regulators ? voltage regulator module (vrm) ? point of load modules ? servers and workstations ? data networking and storage systems ? notebook and desktop computers ? graphics cards and battery power systems ? dcr sensing environmental data ? storage temperature range: -40c to +125 c ? operating temperature range: -40c to +125c (range is application specific) ? solder reflow temperature: j-std-020d compliant packaging ? supplied in tape and reel packaging, 640 parts per reel, 13? diameter reel description ? halogen free ? 125c maximum total temperature operation ? 8.5 x 7.0 x 7.2mm surface mount package ? ferrite core material ? high current carrying capacity ? low core losses ? controlled dcr tolerance for sensing circuits ? inductance range from 72nh to 190nh ? current range from 37 to 90 amps ? frequency range up to 2mhz ? rohs compliant high current power inductors flat-pac? fp0708 series 0110 bu-sb10004 page 1 of 4 data sheet: 4334 smd device 1 open circuit inductance (ocl) test parameters: 100khz, 0.10v rms , 0.0adc 2 full load inductance (fll) test parameters: 100khz, 0.1v rms ,i sat 1 3i rms : dc current for an approximate temperature rise of 40c without core loss. derating is necessary for ac currents. pcb pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. it is recommended the part temperature not exceed 125c under worst case operating conditions verified in the end application. 4i sat 1: peak current for approximately 20% rolloff at +25c. 5i sat 2: peak current for approximately 20% rolloff at +125c. 6 k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i * 10 -3 ,b p-p : (gauss), k: (k-factor from table), l: (inductance in nh), i (peak-to-peak ripple current in amps). 7 part number definition: fp0708rx-rxx-r ? fp0708 = product code and size ? rx is the dcr indicator ? rxx= inductance value in h, r = decimal point ? ?-r? suffix = rohs compliant product specifications part number ocl 1 10% (nh) fll 2 min. (nh) i rms 3 (amps) i sat 1 4 @ 25c (amps) i sat 2 5 @ 125c (amps) dcr (m ) @ 20c k-factor 6 fp0708r1-r07-r 72 52 44 90 72 0.35 8.6% 557 fp0708r1-r09-r 90 64 75 60 557 fp0708r1-r10-r 105 75 68 54 557 fp0708r1-r12-r 120 86 59 47 557 fp0708r1-r15-r 150 108 47 37 557 FP0708R1-R19-R 190 135 37 29 557 pb halogen hf free
d d i i m m e e n n s s i i o o n n s s - - m m m m a = 7.0 max. b = 8.5 max. c = 7.2 max. d = 2.1 0.15 e = 1.52 0.2 f = 3.6 typ. 1 b a 2 a b d e f 2.5 2.2 3.2 1 2 top view 0708r1 rxx wwllyy r side view bottom view recommended pad layout schematic c section a-a a a 7.3 8.60 7.1 user direction of feed 1 2 section b-b b b 6.4 rxx wwllyy 0708rx r 4.50 16.00 +/-0.30 1.5 dia. 12.0 1.5 dia 7.5 1.75 4.0 2.0 0 10 20 30 40 50 60 0.0 0.2 0.4 0.6 0.8 1.0 1.2 total loss (w) temperature rise (c) part marking: coiltronics logo 0708rx (rx = dcr indicator) rxx = inductance value in h (r = decimal point) wwllyy = date code r = revision level supplied in tape-and-reel packaging, 640 parts per reel, 13? diameter reel. packaging information - mm temperature rise vs.total loss 0110 bu-sb10004 page 2 of 4 data sheet: 4334 nominal dcr is measured from point ?a? to point ?b.?
0110 bu-sb10004 page 3 of 4 data sheet: 4334 ocl vs. i 1 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% 120% % o f i 1 % of ocl +125c +25c -40c sat sat core loss vs. b 0.001 0.01 0.1 1 10 0 0 0 0 1 0 0 0 1 0 0 1 b (gauss) core loss (w) 1mhz 500khz 300khz 200khz 100khz p-p p-p inductance characteristics core loss
? 2010 cooper bussmann st. louis, mo 63178 www.cooperbussmann.com 0110 bu-sb10004 page 4 of 4 data sheet: 4334 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. a ll other copies of this document are by definition uncon- trolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. cooper bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it sh ould be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or syste ms without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me package mm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me package mm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tandard s np b s older lead (p b ) free s older pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s a v e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** a v e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
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